Precious metal solder

ABSTRACT

Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300° C. to about 1500° C. for platinum, from about 1000° F. to about 1400° F. for silver, and from about 1100° F. to about 1550° F.

CROSS REFERENCE TO RELATED APPLICATIONS

Under 35 USC § 120, this application is a continuation application ofU.S. application Ser. No. 10/601,139 filed Jun. 20, 2003, now pending;which is divisional application of U.S. application Ser. No. 09/897,692filed Jun. 29, 2001, now issued as U.S. Pat. No. 6,620,378; which is acontinuation-in-part application of U.S. application Ser. No.09/503,419, now issued as U.S. Pat. No. 6,372,060. The disclosure ofeach of the prior applications is considered part of and is incorporatedby reference in the disclosure of this application.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates generally to a solder composition and,more particularly, to a solder composition for assembling, repairingand/or sizing jewelry having a platinum content of up to about 95% byweight.

The present invention also relates generally to a solder compositionand, more particularly, to a solder composition for assembling,repairing and/or sizing jewelry having a silver content of at least92.5% by weight, and the balance being made of an alloy consisting ofgallium, indium and copper in respective ratios of 6:3:1.

The present invention also relates generally to a solder compositionand, more particularly, to a solder composition for assembling,repairing and/or sizing jewelry having a gold content of about 25% toabout 91.6% by weight, and a mixture of other metals including about 8%to about 80% silver, about 1% to about 66% copper, about 5% to about 31%zinc and about 0% to about 35% nickel, said solder compositionconsisting of 2-14% gallium, indium and copper, in respective ratios of6:3:1.

A platinum or silver alloy consisting of gallium, indium and copper isused to lower the melting point of platinum and silver to provide asolder composition having a reduced melting point.

A gold alloy consisting one or more metals including silver, copper,zinc or nickel and further consisting of gallium, indium and copper toprovide a solder composition having a reduced melting point.

More particularly, the platinum solders have melting temperatures in arange from about 1300° C. (2372° F.) to about 1500° C. (2732° F.), andthe gold and silver solders melting temperatures in a range from about1000° F. (538° C.) to about 1400° F. (760° C.).

DESCRIPTION OF THE RELATED ART

A variety of solder compositions are known in the art for repairingplatinum, silver and gold jewelry. These prior art compositions arecharacterized by melting temperatures ranging from about 1000° C. toabout 1700° C. and consist essentially of varying relative amounts byweight of gold, silver and/or palladium. The higher melting temperaturesolder compositions (1600° C. and 1700° C.) are difficult to work withand have melting temperatures that are not significantly lower than themelting temperature of pure platinum (1769° C.). While the lower meltingtemperature compositions are easier to work with than the higher meltingtemperature compositions, all of the compositions are problematic whenused to repair platinum jewelry having a platinum content of at least90% by weight. Specifically, the color of the solder composition doesnot match the color of the high platinum content jewelry. This resultsin an unsightly dark seam or spot of solder that must be temporarilymasked by plating the seam or spot with rhodium. In addition to addingto the cost and complexity of the jewelry repair, the rhodium plating isalso subject to wear over time, whereupon the color difference betweenthe platinum jewelry and the solder composition becomes visible again.Moreover, pitting of the solder at its point of application to thejewelry is often observed, thus further detracting from the appearanceof the repaired jewelry.

It is known to add minor amounts of platinum (up to about 5% by weight)to the above-noted solder compositions, but the problems of colormatching and pitting still persist. Solder compositions combiningpalladium and up to 75% by weight platinum have also been employed, butsuch compositions are characterized by high melting temperatures (1600°C. to 1700° C.) that are not significantly lower than the 1769° C.melting temperature of platinum itself and make the compositionsdifficult to work with. Additionally, color matching and pittingproblems still occur.

Various high platinum content jewelry materials are known in the art.For example, U.S. Pat. No. 4,165,983 discloses an alloy for fabricatingjewelry containing at least 95% by weight platinum, 1.5% to 3.5% byweight gallium, and a balance of at least one of indium, gold,palladium, silver, copper, cobalt, nickel, ruthenium, iridium andrhodium. U.S. Pat. No. 5,846,352 discloses a heat-treatedplatinum-gallium alloy for fabricating jewelry containing 1% to 9% byweight gallium and a small amount of palladium. However, such alloys areintended for fabricating the jewelry itself. Neither of these patentsdisclose or suggest particular solder compositions that would be usefulfor repairing platinum jewelry, and particularly platinum jewelry havinga platinum content of up to about 95% by weight.

The standard of fineness for silver products is sterling or standardsilver (92.5%). The other 7.5% of the silver alloy content can be anymetal but it is usually copper. Similarly, karat gold is an alloy ofgold with other metals. Pure gold is very soft unless alloyed into akarat gold such as 18 karat (75% pure) or 22 carat (91.6% pure). Thegold alloys may contain several other metallic elements includingcopper, silver, nickel and zinc to vary the color, the hardness and themelting points.

Currently, there are no known solder compositions for platinum, silverand gold alloys with low flow temperatures that can be used forrepairing jewelry having a platinum content of at least 90% by weight,having a silver content of at least 92.5% by weight, and having a goldcontent of at least 25% to about 91.6% by weight without incurring theabove-mentioned problems. Accordingly, the development of a soldercomposition for such platinum, silver and gold jewelry that does notinvolve the aforementioned problems would be a significant advance inthe art.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to a solder composition that can beused for assembling, repairing, and/or sizing jewelry having a platinumcontent of up to about 95% by weight. In accordance with the invention,such a solder composition consists essentially of about 90% to about 95%by weight platinum and about 5% to about 10% by weight of an alloy thatprovides the solder composition with a melting temperature in a rangefrom about 1300° C. to about 1500° C.

In accordance with one preferred aspect of the present invention, asolder composition for assembling, repairing, and/or sizing jewelryconsists essentially of about 90% to about 95% by weight platinum, about3% to about 6% by weight gallium, about 1.5% to about 3% by weightindium, and about 0.5% to about 1.0% by weight copper.

In accordance with another preferred aspect of the present invention, asolder composition for assembling, repairing and/or sizing jewelryconsists essentially of about 90% to about 95% by weight platinum andabout 5% to about 10% by weight of an alloy consisting of gallium,indium and copper in a respective weight ratio of approximately 6:3:1.

In accordance with yet another preferred aspect of the presentinvention, there is provided an alloy for lowering the melting point ofplatinum when combined therewith to provide a solder composition havinga reduced melting temperature, the alloy consisting essentially of about60% by weight gallium, about 30% by weight indium and about 10% byweight copper.

Further in accordance with the present invention, there is also provideda method of soldering jewelry containing up to about 95% by weightplatinum. The method comprises the step of soldering a piece of jewelrycontaining up to about 95% by weight platinum with a solder compositionconsisting essentially of about 90% to about 95% by weight platinum andabout 5% to about 10% by weight of an alloy that provides the soldercomposition with a melting temperature in a range from about 1300° C. toabout 1500° C. In a preferred aspect of the inventive method, the soldercomposition consists essentially of about 90% to about 95% by weightplatinum, about 3% to about 6% by weight gallium, about 1.5% to about 3%by weight indium, and about 0.5% to about 1.0% by weight copper.

In accordance with another preferred aspect of the present invention, asolder composition that can be used for assembling, repairing, and/orsizing jewelry having a silver content of at least about 92.5% byweight. In accordance with the invention, such a solder compositionconsists essentially of at least about 92.5% by weight silver and about7.5% of an alloy that provides the solder composition with a meltingtemperature in a range from about 1100° F. to about 1300° F.

In accordance with another preferred aspect of the present invention, asolder composition for assembling, repairing and/or sizing jewelryconsists essentially of about 92.5% by weight silver and about 7.5% ofan alloy consists essentially of gallium, indium and copper in arespective weight ratio of approximately 6:3:1.

In accordance with another preferred aspect of the present invention, asolder composition that can be used for assembling, repairing, and/orsizing jewelry having a gold content of about 25% to about 91.66% byweight gold. In accordance with the invention, such a solder compositionconsists essentially of about 25% to about 91.66% by weight gold andabout 2% to about 14% of an alloy that provides the solder compositionwith a melting temperature in a range from about 1000° F. to about 1550°F.

In accordance with another preferred aspect of the present invention, asolder composition for assembling, repairing and/or sizing jewelryconsists essentially of about 25% (6 karat), 41.66% (10 karat), 58.33%(14 karat), 75% (18 karat) and 91.66% (22 karat) by weight gold and thebalance comprising of about 2% to about 14% by weight of gallium, indiumand copper in a respective weight ratio of approximately 6:3:1.

In accordance with yet another preferred aspect of the presentinvention, there is provided an alloy for lowering the melting point ofsilver when combined therewith to provide a solder composition having areduced melting temperature, the alloy consists essentially of about 60%by weight gallium, about 30% by weight indium and about 10% by weightcopper.

In accordance with yet another preferred aspect of the presentinvention, there is provided an alloy for lowering the melting point ofkarat gold when combined therewith to provide a solder compositionhaving a reduced melting temperature, the alloy consists essentially ofabout 60% by weight gallium, about 30% by weight indium and about 10% byweight copper.

In accordance with the present invention, there is also provided amethod of soldering jewelry containing about 25% to about 91.66% byweight gold. The method comprises the step of soldering a piece ofjewelry containing about 25% to about 91.66% by weight gold with asolder composition consisting essentially of about 2% to about 14% byweight of an alloy that provides the solder composition with a meltingtemperature in a range from about 1000° F. to about 1550° F.

Further, in accordance with the present invention, there is alsoprovided a method of soldering jewelry containing at least 92.5% silver.The method comprises the step of soldering a piece of jewelry containingat least 92.5% by weight silver with a solder composition consistingessentially of about 92.5% by weight silver and about 7.5% by weight ofan alloy that provides the solder composition with a melting temperaturein a range from about 1100° F. to about 1300° F.

DETAILED DESCRIPTION

The present invention provides a solder that is not only easy and safeto use, due to a relatively low flow temperature of 1300° C. to 1500° C.in relation to the melting temperature of platinum (1769° C.), but thatalso, in use, matches the color of platinum jewelry having a platinumcontent up to about 95% by weight. These advantages have not previouslybeen found together in a solder composition for platinum jewelry.

In accordance with the present invention, a solder compositioncontaining about 90% to about 95% by weight platinum combined with analloy that reduces the melting temperature of the solder composition toabout 1300° C. to about 1500° C. eliminates the disadvantages associatedwith prior art solder compositions for platinum jewelry.

The preferred solder compositions of the present invention contain about90% to about 95% by weight platinum. The platinum content of the soldercomposition insures a color match with platinum jewelry containing up toabout 95% by weight platinum. It has been found that solder compositionshaving a platinum content of about 87.5% by weight are unsatisfactoryfor use in the present invention. In this regard, solder compositionswith a platinum content of about 87.5% by weight are too brittle or“ceramic” to roll and fabricate into useful solders. They turn to dust.Conversely, it has been found that solder compositions having platinumcontent above 95% by weight can result in useful solders. However, suchcompositions are extremely hard and possessed of higher meltingtemperatures, which increase the risk of damage to the platinum jewelrythey are used in conjunction with.

The preferred solder compositions of the present invention also containabout 5% to about 10% by weight of an alloy that reduces the meltingtemperature of the solder composition to about 1300° C. to about 1500°C. In this regard, the melting temperature of pure platinum is 1769° C.Accordingly, the alloy reduces the melting temperature of the soldercomposition sufficiently to facilitate its use while avoiding potentialdamage to the platinum jewelry.

It has been found that a suitable alloy for use in the present inventionis an alloy consisting essentially of about 3% to about 6% gallium,about 1.5% to about 3% indium, and about 0.5% to about 1.0% copper,where all percentages are by weight of the solder composition. Aparticularly preferred alloy according to the present invention consistsessentially of gallium, indium and copper in a respective weight ratioof approximately 6:3:1, or 60% by weight gallium, 30% by weight indium,and 10% by weight copper.

The solder compositions of the present invention provide advantagespreviously unattained in known solder compositions for high platinumcontent jewelry.

A primary advantage of the solder compositions of the present inventionis accurate color matching between the solder and the platinum jewelry.In this regard, the color of the disclosed solder compositions matchesthe color of high platinum content jewelry. Old formula solders resultin a color difference between the solder and the jewelry in the form ofa dark seam or spot that damages the look of the jewelry and requiresrhodium plating to mask the spot. Rhodium plating adds to the complexityand cost of a jewelry repair or assembly job. Moreover, rhodium platingwears off, whereupon the discolored spot appears again and creates anunsightly appearance in the jewelry. The solders of the presentinvention eliminate dark color and other color difference problemsheretofore associated with the repair of high platinum content jewelry,e.g., platinum jewelry containing up to about 95% by weight platinum.

Additionally, it has been found that the solders of the presentinvention result in less pitting on the joint or spot where the solderis used in relation to prior known solder compositions for platinumjewelry.

The solders of the present invention flow at 1500° C. or less, which ismuch lower than the flow temperature of high platinum content jewelry.Accordingly, 90% to 95% by weight platinum solders are provided thatflow at low, workable temperatures. Sizing, assembly and many repairscan be performed on high platinum content jewelry without risk to theintegrity of the platinum jewelry itself. Even platinum findings andsettings can be assembled with the solder.

The solders of the present invention do not create any problems bypolishing out, since the hardness of the solders approximates thehardness of most common platinum alloys. Thus, it is possible to polishassembled, sized or repaired platinum jewelry to smooth and brighten thejewelry without adversely affecting the advantageously obtained colormatching. Polishing of prior art solder compositions for platinumjewelry result in a noticeable residual line or dark spot evidencing thecolor difference between the jewelry and the solder used on the jewelry.Moreover, the disclosed solders work equally well when used inconjunction with not only conventional platinum but also cobalt/platinumalloys. Further, the solders are free of cadmium, thus avoiding knownhazards associated with the use of cadmium in solder compositions.

The solders of the present invention are prepared by melting theplatinum and alloy together in specified amounts by any conventionalmethod, e.g., by the known hot torch or electric methods, followed byquenching, rolling and annealing to provide softness to the solder. Ahot torch method is preferred. The solder can be manufactured andprovided for use in any known form. Such forms include, for example,flat sheets of 0.2 mm thickness and predetermined weight and dimension,1 mm diameter round wire, or a paste solder.

The solders of the present invention are ideally used in a method forthe assembly, repair, or sizing of jewelry containing up to about 95% byweight platinum. Such methods per se are well known in the art. Theparticular method of the present invention involves soldering a piece ofjewelry containing up to about 95% by weight platinum with a soldercomposition consisting essentially of about 90% to about 95% by weightplatinum and about 5% to about 10% by weight of an alloy that providesthe solder composition with a melting temperature in a range from about1300° C. to about 1500° F.

The soldering step of the present invention can take place during theassembly, repair and/or sizing of a piece of high platinum contentjewelry. A piece of the solder (e.g., 0.2 mm thickness) is cut to adesired size (e.g., 1 mm×1 mm), placed with tongs at the desiredlocation on the jewelry, and then melted with a hot torch, whereupon thesolder flows into the desired area on the jewelry. Upon removal of thehot torch, the solder rapidly cools, hardens and solidifies.

The potential applications of such a method are many. Thus, for example,a ring from inventory can be adjusted by sizing to a larger or smallersize to fit the finger of a given customer. The solder used to adjustthe ring size will match perfectly in color with the color of theoriginal ring. No seams or dark spots are observed at the interfacebetween the solder and the ring. As another example, the solder can beused in jewelry repair jobs, e.g., when replacing a damaged or brokenplatinum prong on a diamond ring (known as retipping). The solder usedin the retipping procedure will match perfectly in color with the colorof the ring itself and no dark spots or seams are observed at thesolder-jewelry interface. As a final example, the solder can be used ina desired manner during the original assembly of high platinum contentjewelry items. The solder matches perfectly in color with the color ofthe platinum jewelry. No color differences result.

The following Examples 1 to 5 illustrate preferred embodiments of thesolder compositions of the present invention, and the method of makingand using such solder compositions. Comparative Examples 1 to 5illustrate known solder compositions for repairing platinum jewelry.

EXAMPLE 1

A “hard” plumb platinum solder (melting temperature of approximately1500° C.) is prepared by annealing and rolling. A bar of a soldercomposition (5.3 mm×0.75 inches; weight of 125 dwt.) consisting of 95%by weight platinum, 3.0% by weight gallium, 1.5% by weight indium, and0.5% by weight copper is cast with hydrogen and oxygen in an ironupright ingot mold and then quenched in cold water at 40° F. The bar isthen rolled from 5.3 mm to 1.5 mm, annealed on each side for 5 minutesat 1600° F., and quenched in cold water at 40° F. The bar is rolledagain from 1.5 mm to 0.2 mm and quenched again in cold water at 40° F.The solder is then finished in a conventional manner by cutting the 0.2mm strip into pieces of approximately 1.15 dwt. each, which are theneach trimmed to 1 dwt. pieces and individually hand-stamped foridentification.

This solder is then used in an otherwise known manner to assemble and/orrepair jewelry containing from about 90% to about 95% by weightplatinum. The melting temperature of the solder (approximately 1500° C.)makes it relatively easy to work with. The color of the solder matcheswell with the jewelry and does not require any further processing.Additionally, there is no pitting observed on the spot where the solderis used. Occasionally, however, the solder is “too white” to perfectlymatch the color of jewelry containing 90% by weight platinum.

EXAMPLE 2

A “medium” plumb platinum solder (melting temperature of approximately1400° C.) is prepared by annealing and rolling in the identical mannerto that described in Example 1. The initial solder composition (5.3mm×0.75 inches; weight of 125 dwt.) consists of 92.5% by weightplatinum, 4.5% by weight gallium, 2.25% by weight indium, and 0.7% byweight copper.

This solder is then used to assemble and/or repair jewelry containingfrom about 90% to about 95% by weight platinum. The melting temperatureof the solder (approximately 1400° C.) makes it even easier to work withthan the solder of Example 1. The color of the solder matches well withthe jewelry and does not require any further processing. Additionally,there is no pitting observed on the spot where the solder is used.

EXAMPLE 3

An “easy” plumb platinum solder (melting temperature of approximately1300° C.) is prepared by annealing and rolling. A bar of a soldercomposition (4.3 mm×17 mm; weight of 80 dwt.) consisting of 90% byweight platinum, 6.0% by weight gallium, 3.0% by weight indium, and 1.0%by weight copper is cast with hydrogen and oxygen in an iron uprightingot mold and then quenched in cold water at 40° F. The bar is thenrolled from 4.3 mm to 4.2 mm, annealed on each side for 5 minutes at1600° F., and quenched in cold water at 40° F. This rolling, annealingand quenching cycle of steps is repeated numerous times to incrementallyreduce the bar from 4.2 mm to 4.0 mm, from 4.0 mm to 3.9 mm, from 3.9 mmto 3.8 mm, from 3.8 mm to 3.7 mm, from 3.7 mm to 3.5 mm, from 3.5 mm to3.4 mm, from 3.4 mm to 3.0 mm (annealing temperature reduced here to1400° F.), from 3.0 mm to 2.5 mm, from 2.5 mm to 2.0 mm (annealingtemperature reduced here to 1300° F.), from 2.0 mm to 1.3 mm, from 1.3mm to 0.6 mm (annealing temperature reduced here to 1100° F.), from 0.6mm to 0.4 mm, and finally from 0.4 mm to 0.2 mm. While cracking of thebar is observed during the multi-step rolling from 4.0 mm to 2.0 mm,this cracking is ignored and does not affect the final soldercomposition. The solder is then finished in a conventional manner bycutting into 0.2 mm pieces of approximately 1.15 dwt. each, which arethen each trimmed to 1 dwt. pieces and individually hand-stamped foridentification.

This solder is then used to assemble and/or repair jewelry containingfrom about 90% to about 95% by weight platinum. The melting temperatureof the solder (approximately 1300° C.) makes it easy to work with, andeasier than the solders of Examples 1 and 2. The color of the soldermatches well with the jewelry and does not require any furtherprocessing. Additionally, there is no pitting observed on the spot wherethe solder is used.

EXAMPLE 4

A “medium-hard” plumb platinum solder (melting temperature of betweenapproximately 1400° C. and approximately 1500° C.) is prepared byannealing and rolling. A bar of a solder composition (5.3 mm×0.75inches; weight of 125 dwt.) consisting of 94% by weight platinum, 3.6%by weight gallium, 1.8% by weight indium, and 0.6% by weight copper iscast with hydrogen and oxygen in an iron upright ingot mold and thenquenched in cold water at 40° F. The bar is then rolled from 5.3 mm to1.5 mm, annealed on each side for 5 minutes at 1600° F., and quenched incold water at 40° F. The bar is rolled again from 1.5 mm to 0.2 mm andquenched again in cold water at 40° F. The solder is then finished in aconventional manner by cutting the 0.2 mm strip into pieces ofapproximately 1.15 dwt. each, which are then each trimmed to 1 dwt.pieces and individually hand-stamped for identification.

This solder is then used to assemble and/or repair jewelry containingfrom about 90% to about 95% by weight platinum. The melting temperatureof the solder (between approximately 1400° C. and 1500° C.) makes itrelatively easy to work with. The color of the solder matches well withthe jewelry and does not require any further processing. Additionally,there is no pitting observed on the spot where the solder is used.

EXAMPLE 5

The solder compositions of Examples 1 to 3 are utilized in astep-assembly of high platinum content jewelry. First, the “hard” plumbplatinum solder of Example 1 (melting temperature of 1500° C.) is usedto size a 95% by weight platinum ring to fit the finger of a particularcustomer. Second, the “medium” plumb platinum solder of Example 2(melting temperature of 1400° C.) is used to repair the ring by fillingin an observed hole in the body of the ring. This is accomplished at atemperature (1400° C.) that does not melt the solder used in the firstsizing step and cause it to fall out. Finally, the “easy” plumb platinumsolder of Example 3 (melting temperature of 1300° C.) is used to providea replacement prong for a defective prong that constitutes part of asetting for a diamond on the ring. Again, this retipping step isaccomplished at a lower temperature (1300° C.) that will not adverselyaffect the prior two soldering procedures.

COMPARATIVE EXAMPLE 1

A series of known solder compositions for platinum having a meltingpoint of approximately 1300° C. are prepared in known manner. Thesecompositions consist of about 77% to about 80% by weight gold and about20% to about 23% palladium. These solders are then used in a knownmanner to repair jewelry containing from about 90% to about 95% byweight platinum. The color of these solders does not match well with thejewelry and the solders must be rhodium-plated to achieve a temporarycolor match with the jewelry subject to wear over time. Additionally,pitting is observed on the spot where the solder is used.

COMPARATIVE EXAMPLE 2

A series of known solder compositions for platinum having a meltingpoint of approximately 1400° C. are prepared in known manner. Thesecompositions consist of about 65% to about 74% by weight gold, about26.5% to about 30% by weight palladium, and 0% to about 5% by weightplatinum. These solders are then used in a known manner to repairjewelry containing from about 90% to about 95% by weight platinum. Thecolor of these solders does not match well with the jewelry and thesolders must be rhodium-plated to achieve a temporary color match withthe jewelry subject to wear over time. Additionally, pitting is observedon the spot where the solder is used.

COMPARATIVE EXAMPLE 3

A series of known solder compositions for platinum having a meltingpoint of approximately 1500° C. are prepared in known manner. Thesecompositions consist of about 59% to about 70% by weight gold, about 30%to about 39% by weight palladium, and 0% to about 3% by weight platinum.These solders are then used in a known manner to repair jewelrycontaining from about 90% to about 95% by weight platinum. The color ofthese solders does not match well with the jewelry and the solders mustbe rhodium-plated to achieve a temporary color match with the jewelrysubject to wear over time. Additionally, pitting is observed on the spotwhere the solder is used.

COMPARATIVE EXAMPLE 4

A series of known solder compositions for platinum are prepared in knownmanner. These compositions consist of about 25% to about 92.5% by weightpalladium, about 7.5% to about 75% by weight platinum, and 0% to about30% by weight gold. These solders are then used in a known manner torepair jewelry containing from about 90% to about 95% by weightplatinum. The melting temperatures of these solders range from 1600° C.to about 1700° C. and accordingly are difficult to work with as soldercompositions. Additionally, the color of these solders does not matchwell with the jewelry and the solders must be rhodium-plated to achievea temporary color match with the jewelry subject to wear over time.Finally, pitting is observed on the spot where the solder is used.

COMPARATIVE EXAMPLE 5

A series of known solder compositions for platinum are prepared in knownmanner. These compositions consist of about 40% to about 63% by weightgold, about 23% to about 59% by weight silver, 0% to about 1.2% byweight palladium, 0% to about 7% by weight platinum, and 0% to about0.33% by weight copper. These solders are then used in a known manner torepair jewelry containing from about 90% to about 95% by weightplatinum. The melting temperatures of these solders range from about1000° C. to about 1200° C., making the solders easy to work with.However, the color of these solders does not match well with the jewelryand the solders must be rhodium-plated to achieve a temporary colormatch with the jewelry subject to wear over time.

Moreover, similar solder compositions are used to assemble, repair andsize silver and gold containing jewelry. However, the melting point ofgold (1064° C.) and silver (961.93° C.) is considerably lower than thatof the melting point of platinum (1772° C.). Thus, the lower meltingpoints of gold and silver will reflect the changes in solder meltingpoints, respectively.

Again, although the present invention has been described in terms of thepreferred embodiment above, numerous modifications and/or additions tothe above-described preferred embodiments would be readily apparent toone skilled in the art.

By way of example, but not limitation, Examples 6-13 serve to furtherexemplify the scope of the present invention.

EXAMPLE 6

A “22KYE (22 Karat Yellow Easy) Extreme” plumb yellow gold soldercomprises a solder composition consisting of about 91.66% by weight 24karat gold (karating melting temperature of approximately 1615° F.) andabout 2% to about 14% by weight gallium, indium, and copper in a 6:3:1ratio, respectively. The solder composition is allowed to cool to 1600°F. before being cast with hydrogen and oxygen in a steel upright ingotmold for forming a bar. The solder bar is then allowed to cool to aboutroom temperature (approximately 78° F.-80° F.). The solder bar is thencleaned by grinding the edges and rolled to a desired thickness. Anadditional step of annealing is optional depending on desired softness.This rolling, annealing and quenching cycle of steps is repeatednumerous times to incrementally reduce the solder bar to a desiredthickness. Subsequent to each successive cycle the annealing temperatureis reduced appropriately as shown in previous examples using platinum.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 91.66% by weight 24-karat gold. The melting temperatureof the solder (approximately 1400° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 22-karat yellow gold, other colorsof gold including white, pink, red, or green are within the scope of thepresent invention.

EXAMPLE 7

A “18KYE (18 Karat Yellow Easy) Extreme” plumb yellow gold soldercomprises a solder composition consisting of about 75% by weight 24karat gold (karating melting temperature of approximately 1615° F.), andabout 2% to about 14% by weight gallium, indium, and copper in a 6:3:1ratio, respectively. The solder composition is allowed to cool to 1600°F. before being cast with hydrogen and oxygen in a steel upright ingotmold for forming a bar. The solder bar is then allowed to cool to aboutroom temperature (approximately 78° F.-80° F.). The solder bar is thencleaned by grinding the edges and rolled to a desired thickness. Anadditional step of annealing is optional depending on desired softness.This rolling, annealing and quenching cycle of steps is repeatednumerous times to incrementally reduce the solder bar to a desiredthickness. Subsequent to each successive cycle the annealing temperatureis reduced appropriately as shown in previous examples using platinum.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 75% by weight 24-karat gold. The melting temperature ofthe solder (approximately 1250° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 18-karat yellow gold, other colorsof gold including white, pink, red, or green are within the scope of thepresent invention.

EXAMPLE 8

A “14KWE (14 Karat White Easy) Extreme” plumb white gold soldercomprises a solder composition consisting of about 58.33% by weight 24karat gold (karating melting temperature of approximately 1615° F.), andabout 2% to about 14% by weight gallium, indium, and copper in a 6:3:1ratio, respectively. The solder composition is allowed to cool to 1600°F. before being cast with hydrogen and oxygen in a steel upright ingotmold for forming a bar. The solder bar is then allowed to cool to aboutroom temperature (approximately 78° F.-80° F.). The solder bar is thencleaned by grinding the edges and rolled to a desired thickness. Anadditional step of annealing is optional depending on desired softness.This rolling, annealing and quenching cycle of steps is repeatednumerous times to incrementally reduce the solder bar to a desiredthickness. Subsequent to each successive cycle the annealing temperatureis reduced appropriately as shown in previous examples using platinum.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 58.33% by weight 24-karat gold. The melting temperatureof the solder (approximately 1175° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 14-karat white gold, other colorsof gold including yellow, pink, red, or green are within the scope ofthe present invention.

EXAMPLE 9

A “18KWE (18 Karat White Easy) Extreme” plumb white gold soldercomprises a solder composition consisting of about 75% by weight 24karat gold (karating melting temperature of approximately 1615° F.), andabout 2% to about 14% by weight gallium, indium, and copper in a 6:3:1ratio, respectively. The solder composition is allowed to cool to 1600°F. before being cast with hydrogen and oxygen in a steel upright ingotmold for forming a bar. The solder bar is then allowed to cool to aboutroom temperature (approximately 78° F.-80° F.). The solder bar is thencleaned by grinding the edges and rolled to a desired thickness. Anadditional step of annealing is optional depending on desired softness.This rolling, annealing and quenching cycle of steps is repeatednumerous times to incrementally reduce the solder bar to a desiredthickness. Subsequent to each successive cycle the annealing temperatureis reduced appropriately as shown in previous examples using platinum.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 75% by weight 24-karat gold. The melting temperature ofthe solder (approximately 1350° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 18-karat white gold, other colorsof gold including yellow, pink, red, or green are within the scope ofthe present invention.

EXAMPLE 10

A “14KPE (14 Karat Pink Easy) Extreme” plumb pink gold solder comprisesa solder composition consisting of about 58.33% by weight 24 karat gold,(karating melting temperature of approximately 1615° F.), and about 2%to about 14% by weight gallium, indium, and copper in a 6:3:1 ratio,respectively . The solder composition is allowed to cool to 1600° F.before being cast with hydrogen and oxygen in a steel upright ingot moldfor forming a bar. The solder bar is then allowed to cool to about roomtemperature (approximately 78° F.-80° F.). The solder bar is thencleaned by grinding the edges and rolled to a desired thickness. Anadditional step of annealing is optional depending on desired softness.This rolling, annealing and quenching cycle of steps is repeatednumerous times to incrementally reduce the solder bar to a desiredthickness. Subsequent to each successive cycle the annealing temperatureis reduced appropriately as shown in previous examples using platinum.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 58.33% by weight 24-karat gold. The melting temperatureof the solder (approximately 1550° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 14-karat pink gold, other colors ofgold including yellow, white, red, or green are within the scope of thepresent invention.

EXAMPLE 11

A “10KYXE (10 Karat Yellow Easy) Extreme” plumb yellow gold soldercomprises a solder composition consisting of about 41.66% by weight 24karat gold, base metals, plus about 2% to about 14% gallium, indium andcopper (karating melting temperature of approximately 1665° F.). Thesolder composition is allowed to cool to 1600° F. before being cast withhydrogen and oxygen in a steel upright ingot mold for forming a bar. Thesolder bar is then allowed to cool to about room temperature(approximately 78° F.-80° F.). The solder bar is then cleaned bygrinding the edges and rolled to a desired thickness. Rolling the solderbar reduces it by 80%. Then an annealing step is performed at 1000° F.for 20 minutes. The solder bar is then further cooled to about roomtemperature (approximately 78° F.-80° F.), then immersed in 95% waterplus 5% sparex. The solder bar is then rinsed and scrubbed using a steelbrush. The solder bar is then further rolled down to a desiredthickness. The solder is finished in a conventional manner andindividually hand-stamped for identification. The solder is thenfinished in a conventional manner and individually hand-stamped foridentification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 41.66% by weight 24-karat gold. The melting temperatureof the solder (approximately 1100° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 10-karat yellow gold, other colorsof gold including white, pink, red, or green are within the scope of thepresent invention.

EXAMPLE 12

A “10KWE (10 Karat White Easy) Extreme” plumb white gold soldercomprises a solder composition consisting of about 41.66% by weight 24karat gold, base metals, plus about 2% to about 14% by weight gallium,indium and copper in a 6:3:1 ratio, respectively (karating meltingtemperature of approximately 1665° F.). The solder composition isallowed to cool to 1600° F. before being cast with hydrogen and oxygenin a steel upright ingot mold for forming a bar. The solder bar is thenallowed to cool to about room temperature (approximately 78° F.-80° F.).The solder bar is then cleaned by grinding the edges and rolled to adesired thickness. Rolling the solder bar reduces it by 80%. Then anannealing step is performed at 1000° F. for 20 minutes. The solder baris then further cooled to about room temperature (approximately 78°F.-80° F.), then immersed in 95% water plus 5% sparex. The solder bar isthen rinsed and scrubbed using a steel brush. The solder bar is thenfurther rolled down to a desired thickness. The solder is finished in aconventional manner and individually hand-stamped for identification.The solder is then finished in a conventional manner and individuallyhand-stamped for identification.

This plumb solder is then used to assemble and/or repair jewelrycontaining about 41.66% by weight 24-karat gold. The melting temperatureof the solder (approximately 1100° F.) makes it easy to work with. Thecolor of the solder matches well with the jewelry and does not requireany further processing. Additionally, there is no pitting observed onthe spot where the solder is used.

Although this example is directed to 10-karat white gold, other colorsof gold including yellow, pink, red, or green are within the scope ofthe present invention.

EXAMPLE 13

A “below extra easy” plumb silver solder comprises of a soldercomposition of consisting of least 92.5% by weight silver, 4.5% byweight gallium, 2.25% by weight indium, and 0.75% by weight copper(melting temperature of approximately 1665° F.). The solder compositionis allowed to cool to 1600° F. before being cast with hydrogen andoxygen in a steel upright ingot mold for forming a bar. The solder baris then allowed to cool to about room temperature (approximately 78°F.-80° F.). The solder bar is then cleaned by grinding the edges androlled to a desired thickness. An additional step of annealing isoptional depending on desired softness. This rolling, annealing andquenching cycle of steps is repeated numerous times to incrementallyreduce the solder bar to a desired thickness. Subsequent to eachsuccessive cycle the annealing temperature is reduced appropriately asshown in previous examples using platinum. The solder is then finishedin a conventional manner and individually hand-stamped foridentification. This plumb solder is then used to assemble and/or repairjewelry containing at least 92.5% by weight silver. The meltingtemperature of the solder (approximately 1100° F.) makes it easy to workwith. The color of the solder matches well with the jewelry and does notrequire any further processing. Additionally, there is no pittingobserved on the spot where the solder is used.

While the present invention has been disclosed and described withrespect to particular and preferred embodiments, various modificationsand alternatives will be apparent and will suggest themselves to thoseof ordinary skill in the art. Such modifacations and alternatives do notdepart from and are within the spirit and scope of the presentinvention, which is only to be limited as set forth in the appendedclaims.

1. A precious metal composition comprising of about 25% to 92% by weightgold mixture and an alloy, wherein the composition is free of palladium.2. The composition of claim 1, wherein the alloy comprises about 2% to14% by weight gallium, indium and copper in a respective weight ratio ofapproximately 6:3:1.
 3. The composition of claim, wherein the mixturefurther comprises about 8% to 80% silver, about 1% to 66% copper, about5% to 31% zinc and about 0% to 35% nickel.
 4. The composition of claim1, wherein the mixture is about 25% by weight gold.
 5. The compositionof claim 1, wherein the mixture is about 41.6% by weight gold.
 6. Thecomposition of claim 1, wherein the mixture is about 58.3% by weightgold.
 7. The composition of claim 1, wherein the mixture is about 75% byweight gold.
 8. The composition of claim 1, wherein the mixture is about91.6% by weight gold.
 9. The precious metal composition of claim 1,wherein the composition has a melting temperature lower than a preciousmetal composition in the presence of palladium.
 10. The precious metalcomposition of claim 1, wherein the composition has a meltingtemperature in the range from about 1000° F. to 1550° F.
 11. Theprecious metal composition of claim 1, wherein the composition has amelting temperature in the range from about 1100° F. to 1550° F.
 12. Aprecious metal composition comprising of about 25% to 92% by weight goldmixture and an alloy comprising about 2% to 14% by weight gallium,indium and copper in a respective weight ratio of approximately 6:3:1,and wherein the composition is free of palladium.